发明名称 PREPREG PACKAGE AND METHOD OF PRODUCING PREPREG PACKAGE
摘要 <p>PROBLEM TO BE SOLVED: To provide a prepreg package which can provide a prepreg having good wiring embedding properties on use and a method of producing a prepreg package.SOLUTION: A prepreg package 1 comprises a prepreg composite body 10 and a housing body 40 having a closed space 40A. The prepreg composite body 10 includes a prepreg 20 and protective films 30 laminated on both sides of the prepreg 20. The prepreg 20 consists of a laminate which includes a plurality of prepreg bodies 23 consisting of a fiber substrate 21 impregnated with a resin composition 22. The housing body 40 houses the prepreg composite body 10 in such a state as to hold the prepreg composite body 10 within the closed space 40A.</p>
申请公布号 JP2014196420(A) 申请公布日期 2014.10.16
申请号 JP20130072876 申请日期 2013.03.29
申请人 NIPPON ZEON CO LTD 发明人 KATAYAMA TAKEHIKO
分类号 C08J5/24;H05K3/28 主分类号 C08J5/24
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