发明名称 Systems and methods for separating components of a multilayer stack of electronic components
摘要 Systems and methods for separating components of a multilayer stack of electronic components. The multilayer stack includes an electronic assembly, a substrate, and a sacrificial anode portion that is located between the electronic assembly and the substrate and that operatively attaches the electronic assembly to the substrate. The systems and methods may include locating the multilayer stack within an electrically conductive fluid to form an electrochemical cell. The systems and methods further may include generating a potential difference between a cathode portion of the electronic assembly and the sacrificial anode portion such that the cathode portion forms a cathode of the electrochemical cell and the sacrificial anode portion forms an anode of the electrochemical cell. The systems and methods additionally may include separating the electronic assembly from the substrate by electrochemically oxidizing the sacrificial anode portion to dissolve the sacrificial anode portion within the electrically conductive solution.
申请公布号 EP2775530(A3) 申请公布日期 2014.10.15
申请号 EP20140151929 申请日期 2014.01.21
申请人 THE BOEING COMPANY 发明人 WOO, ROBYN L.;ZHANG, XIAOBO;FETZER, CHRISTOPHER M.;REHDER, ERIC M.
分类号 H01L31/0687;C25F3/12;C25F3/14;C25F5/00;H01L21/3063;H01L21/78;H01L31/18 主分类号 H01L31/0687
代理机构 代理人
主权项
地址