发明名称 Water absorbing agent and production method thereof
摘要 The present invention provides a water absorbing agent, including: water absorbent resin particles; and a modified cationic polymer compound containing a primary amino group and/or a secondary amino group, the modified cationic polymer compound being obtained by reacting, with a modifying agent, a cationic polymer compound containing the primary amino group and/or the secondary amino group, and the modifying agent containing two or more carbon atoms continuously linked, and one reactive group which reacts with the primary amino group and/or the secondary amino group. The present invention further provides a method for producing a water absorbing agent including water absorbent resin particles, the method including the step (i) of mixing the water absorbent resin particles with a modified cationic polymer compound.
申请公布号 US8845924(B2) 申请公布日期 2014.09.30
申请号 US200812678006 申请日期 2008.09.26
申请人 Nippon Shokubai Co., Ltd. 发明人 Adachi Yoshifumi;Torii Kazushi;Watanabe Yusuke;Kobayashi Taishi;Kitayama Toshimasa;Suzuki Seiichi;Yoneda Atsuro
分类号 C09K3/00;C08F120/06;C08G73/02;C08L33/02;C08F8/32;C08L79/02;C08F220/06;C08K5/09;C08F222/10 主分类号 C09K3/00
代理机构 Roylance, Abrams, Berdo & Goodman, L.L.P. 代理人 Roylance, Abrams, Berdo & Goodman, L.L.P.
主权项 1. A water absorbing agent comprising: water absorbent resin particles, the surface of the water absorbent resin particles is cross-linked by a polyalcohol surface cross-linking agent; and a modified cationic polymer compound containing a secondary amino group, said modified cationic polymer being obtained by reacting a cationic polymer compound containing the secondary amino group with a modifying agent, wherein all of the secondary amino groups of the cationic polymer compound do not react with the modifying agent, and some of the secondary amino groups still remain unreacted with the modifying agent, the cationic polymer compound having a cationic value of from 1 to 22 mmol/g, and a secondary cationic value of from 0.1 to 11 mmol/g.
地址 Osaka JP