HIGH RELIABILITY ETCHED-FACET PHOTONIC DEVICES

摘要

Semiconductor photonic device surfaces are covered with a dielectric or a metal protective layer. The protective layer covers the entire device, including regions near facets at active regions, to prevent bare or unprotected semiconductor regions, thereby to form a very high reliability etched facet photonic device.

主权项

1. A method of fabricating a packaged photonic device, comprising:
forming on a top surface of a substrate a semiconductor structure comprising an active layer; etching at least one facet in said semiconductor structure; covering all surfaces of said semiconductor structure within 750 nm of said active layer at least one facet with a protective layer of a dielectric or metal material; forming an electrically conductive contact on a top surface of said semiconductor structure; singulating said substrate comprising said semiconductor structure to form a photonic device; and packaging said photonic device in a non-hermetic package.