Method of making a high frequency device package

摘要

A fabrication method for a low-cost high-frequency electronic device package having waveguide structures formed from the high frequency device to the package lead transition. The package lead transition is optimized to take advantage of waveguide interconnect structure.

主权项

1. A process for creating a high frequency package, comprising:
forming a conductive leadframe having one or more leads, said leadframe having top and bottom surfaces, said bottom surface forming one or more printed circuit board attachment areas, said top surface forming a wirebond and one or more conductive electrical component attachment areas; forming an insulating material around said conductive leadframe; attaching at least one electrical component to the one or more conductive electrical component attachment areas; and forming a waveguide between the at least electrical component and at least one of the leads of the leadframe.