| 发明名称 |
POLISHING SYSTEM WITH FRONT SIDE PRESSURE CONTROL |
| 摘要 |
<p>A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head.</p> |
| 申请公布号 |
WO2014144861(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
WO2014US29450 |
申请日期 |
2014.03.14 |
| 申请人 |
APPLIED MATERIALS, INC. |
发明人 |
CHANG, SHOU-SUNG;FUJIKAWA, TAKASHI;CHEN, HUNG CHIH;BUTTERFIELD, PAUL D. |
| 分类号 |
H01L21/304 |
主分类号 |
H01L21/304 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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