| 发明名称 |
ADVANCED COOLING FOR POWER MODULE SWITCHES |
| 摘要 |
A system includes an electronic device, a heat spreader with a vapor chamber attached to a bottom end of the electronic device, so that heat flows from the electronic device to the heat spreader, and a heat sink with microchannels running through it attached to a bottom end of the heat spreader, so that heat from the heat spreader flows through the heat sink and to an ambient. A method for cooling a device includes transferring heat generated by a device through a conductivity layer, spreading the heat through a heat spreader, transferring the heat from the heat spreader to a heat sink that contains microchannels, and releasing the heat from the heat sink into an ambient. |
| 申请公布号 |
US2014268572(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201313836395 |
申请日期 |
2013.03.15 |
| 申请人 |
HAMILTON SUNDSTRAND CORPORATION |
发明人 |
Ranjan Ram;Pearson Matthew Robert;Krishnamurthy Shashank |
| 分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A system comprising:
an electronic device; a heat spreader with a vapor chamber attached to a bottom end of the electronic device, so that heat flows from the electronic device to the heat spreader; and a heat sink with microchannels running through it attached to a bottom end of the heat spreader, so that heat from the heat spreader flows to the heat sink. |
| 地址 |
Windsor Locks CT US |
