发明名称 METHOD FOR QUANTIFYING DEFECTS IN TRANSPARENT SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide an apparatus, system, and/or methods capable of measuring one-dimensional optical path length variations of transparent substrates.SOLUTION: Disclosed is a method for the detection and quantification of defects in transparent substrates, particularly in glass sheets. The method comprises providing a transparent planar substrate having a top surface and a bottom surface. The surface topography of at least a portion of the top surface of the provided transparent planar substrate is measured to obtain a three-dimensional top surface profile having a sub-nanometer level of precision. From the three-dimensional top surface profile measurement, the existence of one or more surface variations in the three-dimensional top surface profile having amplitude greater than a predetermined tolerance can be identified and/or quantified.
申请公布号 JP2014167485(A) 申请公布日期 2014.09.11
申请号 JP20140095980 申请日期 2014.05.07
申请人 CORNING INC 发明人 KEITH M HILL;RANDY L MCCLURE;RICHARD S PRIESTLEY
分类号 G01N21/958;G01B11/30 主分类号 G01N21/958
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