发明名称 |
LOW LEAKAGE DUAL STI INTEGRATED CIRCUIT INCLUDING FDSOI TRANSISTORS |
摘要 |
The invention relates to an integrated circuit (9), including: -a UTBOX layer (4); -a first cell, comprising: -FDSOI transistors (1a, 1b); -a first STI (23) separating said transistors; -a first ground plane (31) located beneath one of said transistors and beneath said UTBOX layer (4); -a first well (93); -a second cell, comprising : -FDSOI transistors (1c, 1d); -a second STI (25) separating said transistors; -a second ground plane (32) located beneath one of said transistors and beneath said UTBOX layer (4); -a second well (94); -a third STI (24) separating said cells, reaching the bottom of said first and second wells (93, 94); -a deep well (92) extending continuously beneath said first and second wells, having a portion (33) beneath said third STI (24) whose doping density is at least 50% higher than the doping density of the deep well beneath said first and second STIs. |
申请公布号 |
WO2014131459(A1) |
申请公布日期 |
2014.09.04 |
申请号 |
WO2013EP54081 |
申请日期 |
2013.02.28 |
申请人 |
COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIESALTERNATIVES;INTERNATIONAL BUSINESS MACHINES CORPORATION;STMICROELECTRONICS, INC. |
发明人 |
VINET, MAUD;CHENG, KANGGUO;DORIS, BRUCE;GRENOUILLET, LAURENT;KHAKIFIROOZ, ALI;LE TIEC, YANNICK;LIU, QING |
分类号 |
H01L27/12;H01L21/762;H01L21/8238 |
主分类号 |
H01L27/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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