| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component placing table capable of surely placing even a substrate or die having a different size, and a die bonder including the table. ! SOLUTION: An electronic component placing table comprises a body part 31 and a chuck part 34 formed on one surface of the body part. In the electronic component D placing table for placing an electronic component on the surface of the chuck part, a chuck part is formed by a porous member, a vacuum introducing hole 311 for introducing a vacuum into the inside is formed in a part of the body part, and a buffer plate 341 having a groove previously formed corresponding to the electronic component adsorbed on the adsorption surface of the chuck part is provided between the chuck part and the electronic component. The electronic component is adsorbed and placed on the surface of the chuck part consisting of the porous member by the vacuum introduced to the vacuum introducing hole through the groove 342 of the buffer plate. ! COPY |
