发明名称 |
WAFER FOR SOLAR CELL, METHOD OF PRODUCING WAFER FOR SOLAR CELL, METHOD OF PRODUCING SOLAR CELL, AND METHOD OF PRODUCING SOLAR CELL MODULE |
摘要 |
Provided is a wafer for solar cell which can be produced using a polycrystalline semiconductor wafer cut out using a bonded abrasive wire, which wafer can be used for manufacturing a solar cell with high conversion efficiency.;In a wafer for solar cell before acid texturing of the present invention, produced from a polycrystalline semiconductor wafer cut out using a bonded abrasive wire, an amorphous layer does not exist, and irregularities caused due to the cutting using the bonded abrasive wire are left in at least one surface of the wafer for solar cell. |
申请公布号 |
US2014238487(A1) |
申请公布日期 |
2014.08.28 |
申请号 |
US201214347605 |
申请日期 |
2012.09.24 |
申请人 |
SUMCO Corporation |
发明人 |
Okuuchi Shigeru |
分类号 |
H01L31/0236;H01L31/0368 |
主分类号 |
H01L31/0236 |
代理机构 |
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代理人 |
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主权项 |
1. A wafer for solar cell before acid texturing, produced from a polycrystalline semiconductor wafer cut out using a bonded abrasive wire,
wherein an amorphous layer does not exist, and irregularities caused due to the cutting using the bonded abrasive wire are left in at least one surface of the wafer for solar cell. |
地址 |
Minato-ku, Tokyo JP |