| 摘要 |
<p>An electronic component built-in substrate of the present invention includes a first substrate, an electronic component which is mounted on the first substrate and includes a side, a first resin which is installed on the first substrate and covers the side of the electronic component, a second substrate which is installed in the upper part of the electronic component and the first resin and is stacked on the first substrate, a substrate connection member which is installed between the first substrate and the second substrate and electrically connects the first substrate and the second substrate, a second resin which is filled between the electronic component and the second substrate and between the first resin and the second substrate, and a third resin which is filled between the first substrate and the second substrate and encapsulates the substrate connection member, the electronic component, and the second resin.</p> |
