Method and system for a semiconductor device package with a die-to-die first bond

摘要

Methods for a semiconductor device package with a die-to-die first bond are disclosed and may include bonding one or more semiconductor die comprising electronic devices to an interposer die. An underfill material may be applied between the semiconductor die and the interposer die, and a mold material may be applied to encapsulate the semiconductor die. The interposer die may be thinned to expose through-silicon-vias (TSVs). The bonding of the semiconductor die may comprise adhering the semiconductor die to an adhesive layer, and bonding the semiconductor die to the interposer die. The semiconductor die may comprise micro-bumps for coupling to the interposer die, wherein the bonding comprises: positioning the micro-bumps in respective wells in a layer disposed on the interposer die; and bonding the micro-bumps to the interposer die. The semiconductor die may be bonded to the interposer die utilizing a mass reflow process or a thermal compression process.

主权项

1. A method for semiconductor packaging, the method comprising:
bonding one or more semiconductor die comprising electronic devices to an interposer die; applying an underfill material between said one or more semiconductor die and said interposer die; applying a mold material to encapsulate the one or more bonded semiconductor die; thinning said interposer die to expose through-silicon-vias (TSVs); applying metal contacts to said exposed TSVs; and bonding said interposer die with the bonded one or more semiconductor die to a packaging substrate, wherein said bonding said one or more semiconductor die comprises:
adhering said one or more semiconductor die to an adhesive layer; andbonding the adhered one or more semiconductor die to said interposer die.