Packaged electrical components

摘要

An electrical component package has a connection lead structure which is formed with a height step 30 at the location where the connection lead structure exits the package. The size of the height is dependent on the sum of the thickness tolerance variations of the first set of layers and the base, such that after the height step, the height of the connection lead structure with respect to the base of the package is independent of these thickness tolerance variations. This reduces the required tolerances for the soldering and assembly processes.