PACKAGE, OPTICAL MODULE, AND ELECTRONIC APPARATUS

摘要

A base substrate, a lid that forms an internal space capable of housing a device (variable-wavelength interference filter), and a brazing filler that joins the lid to the base substrate are provided. The lid has: a lid joining portion having a base facing surface that faces the base substrate, an inner lateral surface that continues at an inner end on the side of the internal space of the base facing surface and faces the internal space, an outer lateral surface, and an upper surface; and a lid sidewall portion standing up in a direction away from the base substrate from the upper surface of the lid joining portion. The brazing filler is provided along the base facing surface and the outer lateral surface from the inner end to the upper end of the outer lateral surface via an outer end opposite to the inner end.

主权项

1. A package comprising:
a base substrate; a lid that forms an internal space capable of housing a device between the base substrate and the lid; and a brazing filler that joins the lid to the base substrate; wherein the lid has: a lid joining portion having a base facing surface that faces the base substrate, an inner lateral surface that continues at an inner end on the side of the internal space of the base facing surface and faces the internal space, an outer lateral surface that continues at an outer end opposite to the inner end of the base facing surface, and an upper surface that continues at an upper end opposite to the outer end of the outer lateral surface; and a lid sidewall portion standing up in a direction away from the base substrate from the upper surface of the lid joining portion, and the brazing filler is provided along the base facing surface and the outer lateral surface from the inner end to the upper end via the outer end.