发明名称 MULTI-CHANNEL MEMORY MODULE
摘要 Embodiments of the invention describe a motherboard PCB having a memory bus to receive signal data from a channel of memory chips/devices of a memory module. Electrical contacts, communicatively coupled to the memory bus, securely couple the PCB to the memory chips/devices of the memory module. Embodiments of the invention further include a receiving housing that includes said electrical contacts and has a height less or equal to the height of the memory module.;Embodiments of the invention further describe a memory module having a memory card housing, first and second pluralities of memory chips/devices included in the housing, and first and second pluralities of memory module electrical I/O terminals for coupling the first and second pluralities of memory chips/devices to PCB, respectively. In embodiments of the invention, the above described first and second pluralities electrical I/O connectors are disposed on different sides of the housing.
申请公布号 US2014185226(A1) 申请公布日期 2014.07.03
申请号 US201213730505 申请日期 2012.12.28
申请人 Lam Hue V.;Doan Loc V. 发明人 Lam Hue V.;Doan Loc V.
分类号 G06F1/16 主分类号 G06F1/16
代理机构 代理人
主权项 1. A memory module comprising: a memory card housing having a plurality of sides; a first plurality of memory devices included in the memory card housing; a second plurality of memory devices included in the memory card housing; a first plurality of memory module electrical terminals for coupling the first plurality of memory devices to a computing device printed circuit board (PCB); and a second plurality of memory module electrical terminals for coupling the second plurality of memory devices to the computing device PCB, wherein the first and second plurality of memory module electrical terminals are disposed on different sides of the memory card housing.
地址 Portland OR US