摘要 |
Embodiments of the invention describe a motherboard PCB having a memory bus to receive signal data from a channel of memory chips/devices of a memory module. Electrical contacts, communicatively coupled to the memory bus, securely couple the PCB to the memory chips/devices of the memory module. Embodiments of the invention further include a receiving housing that includes said electrical contacts and has a height less or equal to the height of the memory module.;Embodiments of the invention further describe a memory module having a memory card housing, first and second pluralities of memory chips/devices included in the housing, and first and second pluralities of memory module electrical I/O terminals for coupling the first and second pluralities of memory chips/devices to PCB, respectively. In embodiments of the invention, the above described first and second pluralities electrical I/O connectors are disposed on different sides of the housing. |