| 摘要 |
The present invention relates to an apparatus for cleaning and drying a wafer. Provided is a Marangoni-type apparatus for cleaning and drying a wafer, which includes: a cleaning tank for receiving a solution to clean a disc-shaped wafer and including a first discharge penetrate to be adjacent to a water surface of a second region and wherein the wafer is dipped and discharged in a same first region, and the first region is partitioned from the second region on a liquid surface by a partition but is communicated with the second region in the solution; an IPA gas supply unit for supplying IPA gas into the cleaning tank in order for an IPA liquid layer to be formed on the surface of the solution; and a moving unit for moving the wafer into the solution to sink through the first region and for withdrawing the wafer out through the first region when the wafer has been completely cleaned. The wafer is dipped and discharged in one first region, and the second region is distinguished from the first region in a liquid surface by the partition. A contaminated solution is discharged through a discharge port of the second region, so that contaminated water is discharged from the second region. Accordingly, the fluctuation of the liquid surface in the first region in which the wafer is dipped and discharged is prevented, so that the cleaning and drying process of the wafer based on a Marangoni-type method can be efficiently performed. |
