| 发明名称 | Contactless communications using ferromagnetic material | ||
| 摘要 | A communications structure comprises a first semiconductor substrate having a first coil, and a second semiconductor substrate having a second coil above the first semiconductor substrate. Inner edges of the first and second coils define a boundary of a volume that extends below the first coil and above the second coil. A ferromagnetic core is positioned at least partially within the boundary, such that a mutual inductance is provided between the first and second coils for wireless transmission of signals or power between the first and second coils. | ||
| 申请公布号 | US8760255(B2) | 申请公布日期 | 2014.06.24 |
| 申请号 | US201113206584 | 申请日期 | 2011.08.10 |
| 申请人 | Taiwan Semiconductor Manufacturing Co., Ltd. | 发明人 | Yang Ping-Lin;Jin Jun-De;Hsueh Fu-Lung;Liu Sa-Lly;Ong Tong-Chern;Lin Chun-Jung;Kao Ya-Chen |
| 分类号 | H01F5/00 | 主分类号 | H01F5/00 |
| 代理机构 | Duane Morris LLP | 代理人 | Duane Morris LLP ;Koffs Steven E. |
| 主权项 | 1. A communications structure, comprising: a first semiconductor substrate having a first coil, and a second semiconductor substrate having a second coil above the first semiconductor substrate, wherein inner edges of the first and second coils define a boundary of a volume that extends below the first coil and above the second coil; and a ferromagnetic core positioned at least partially within the boundary, such that a mutual inductance is provided between the first and second coils for wireless transmission of signals or power between the first and second coils. | ||
| 地址 | Hsin-Chu TW | ||