发明名称 Method for manufacturing semiconductor device
摘要 A method for manufacturing a semiconductor device includes irradiating light to an effective region of a semiconductor substrate. A wavelength of the light is a wavelength adapted so that light absorptance of the semiconductor substrate increases if an intensity of the light increases. The light is irradiated so that a focus point of the light is made within the semiconductor substrate in the irradiating.
申请公布号 US8748236(B2) 申请公布日期 2014.06.10
申请号 US201013578131 申请日期 2010.11.10
申请人 Toyota Jidosha Kabushiki Kaisha 发明人 Tanida Atsushi
分类号 H01L21/268;H01L21/761;H01L29/739;H01L21/78;H01L29/32;H01L27/12 主分类号 H01L21/268
代理机构 代理人
主权项 1. A method for manufacturing a semiconductor device, comprising: irradiating light to a semiconductor substrate, wherein a wavelength of the light is a wavelength adapted so that light absorptance of the semiconductor substrate increases if an intensity of the light increases, and the light is irradiated so that a focus point of the light is made in a region which is within the semiconductor substrate and, dividing the semiconductor substrate into semiconductor devices so that said region is included in at least an internal portion of a semiconductor layer of at least one of the semiconductor device, wherein the internal portion is not located at a surface of the semiconductor layer, wherein an IGBT is formed in the semiconductor substrate, and the focus point is made within a drift region of the IGBT.
地址 Toyota-Shi JP