SEMICONDUCTOR-DEVICE MANUFACTURING METHOD

摘要

A semiconductor-device manufacturing method that includes a step (A) in which a third laminate is prepared by laminating together the following: a first laminate provided with a first adhesive layer on a first mount; a second laminate provided with a second adhesive layer on a second mount; and a thermosetting resin sheet in which a plurality of semiconductor chips are embedded, said thermosetting resin sheet being provided between the first-adhesive-layer-side surface of the first laminate and the second-adhesive-layer-side surface of the second laminate. This semiconductor-device manufacturing method also includes the following: a step (B) in which the thermosetting resin sheet in the third laminate is thermally cured; a step (C) in which, after the thermosetting resin sheet is thermally cured, the first laminate is detached at the interface where the first adhesive layer of the first laminate is bonded to the thermosetting resin sheet; and a step (D) in which wiring is formed on the thermosetting resin sheet after the first laminate has been detached.