发明名称 METHOD FOR MANUFACTURING EPITAXIAL SILICON WAFER, EPITAXIAL SILICON WAFER, AND METHOD FOR MANUFACTURING SOLID STATE IMAGE SENSOR
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing an epitaxial silicon wafer capable of suppressing metal pollution by exerting higher gettering capability, and reducing lamination defects in an epitaxial layer.SOLUTION: A method for manufacturing an epitaxial silicon wafer comprises: a first step for forming a modified layer 18 in which composing elements of a cluster ion 16 are solidly solved therein, on a surface 10A of a silicon wafer 10, by irradiating the cluster ion 16 to the silicon wafer 10 having an oxygen concentration of 16×10atoms/cm(ASTM F121-1979) or less; and a second step for forming an epitaxial silicon layer 20 on the modified layer 18 of the silicon wafer 10.
申请公布号 JP2014099481(A) 申请公布日期 2014.05.29
申请号 JP20120249681 申请日期 2012.11.13
申请人 SUMCO CORP 发明人 KADONO TAKESHI;KURITA KAZUNARI
分类号 H01L21/322;C23C14/48;H01L21/20;H01L21/205;H01L21/265;H01L27/146 主分类号 H01L21/322
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