发明名称 |
METHOD FOR MANUFACTURING EPITAXIAL SILICON WAFER, EPITAXIAL SILICON WAFER, AND METHOD FOR MANUFACTURING SOLID STATE IMAGE SENSOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an epitaxial silicon wafer capable of suppressing metal pollution by exerting higher gettering capability, and reducing lamination defects in an epitaxial layer.SOLUTION: A method for manufacturing an epitaxial silicon wafer comprises: a first step for forming a modified layer 18 in which composing elements of a cluster ion 16 are solidly solved therein, on a surface 10A of a silicon wafer 10, by irradiating the cluster ion 16 to the silicon wafer 10 having an oxygen concentration of 16×10atoms/cm(ASTM F121-1979) or less; and a second step for forming an epitaxial silicon layer 20 on the modified layer 18 of the silicon wafer 10. |
申请公布号 |
JP2014099481(A) |
申请公布日期 |
2014.05.29 |
申请号 |
JP20120249681 |
申请日期 |
2012.11.13 |
申请人 |
SUMCO CORP |
发明人 |
KADONO TAKESHI;KURITA KAZUNARI |
分类号 |
H01L21/322;C23C14/48;H01L21/20;H01L21/205;H01L21/265;H01L27/146 |
主分类号 |
H01L21/322 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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