发明名称 INSPECTION DEVICE AND INSPECTION METHOD
摘要 PROBLEM TO BE SOLVED: To provide an inspection device and inspection method by which the amount of error of the mounting position of an inspection target that is mounted on a stage can be obtained in a short time.SOLUTION: For example, a plurality of distance measuring sensors (measuring instruments) LSENw1 to LSENw3, LSENn1, and LSENn2 are arranged at positions that are opposed to a side surface of a semiconductor wafer WF mounted on a stage and are different from each other. Each of the distance measuring sensors (measuring instruments) irradiates the side surface of the WF with an electromagnetic wave and detects a reflection wave therefrom, thereby measuring each of the distances from the corresponding side surfaces. According to measurement results from LSENw1 to LSENw3, the amount of eccentricity error of the mounting position of the WF is calculated, and according to measurement results from LSENn1 and LSENn2 targeting a notch NC for measurement, the amount of rotation error of the mounting position of the WF is calculated.
申请公布号 JP2014092489(A) 申请公布日期 2014.05.19
申请号 JP20120243877 申请日期 2012.11.05
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 MITSUI HIDEO ; TAKAHASHI KAZUO
分类号 G01B11/00;G01B11/27;G01B21/00;H01L21/66 主分类号 G01B11/00
代理机构 代理人
主权项
地址