发明名称 |
THERMAL TRANSFER OF MICROSTRUCTURED LAYERS |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide articles having a component with a surface defining microstructured features.SOLUTION: The articles having a component with a surface defining microstructured features can be formed using thermal transfer elements. One example of a suitable thermal transfer element includes a microstructured layer having a surface defining microstructured features made on the microstructured layer. The thermal transfer element is configured and arranged for transfer of at least a portion of the microstructured layer to a receptor while substantially preserving the microstructured features of that portion.</p> |
申请公布号 |
JP2014080033(A) |
申请公布日期 |
2014.05.08 |
申请号 |
JP20140003094 |
申请日期 |
2014.01.10 |
申请人 |
3M INNOVATIVE PROPERTIES CO |
发明人 |
DEBE MARK K;WOLK MARTIN B |
分类号 |
B44C1/17;B81C99/00;B41M3/00;B41M5/382;B41M5/385;B41M5/40;B41M5/42;B81C1/00;H01J7/24;H01J9/02;H01L21/48;H01L21/68;H05K3/04 |
主分类号 |
B44C1/17 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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