| 摘要 |
PROBLEM TO BE SOLVED: To provide a pad structure for reducing exfoliation.SOLUTION: One or more technologies or a system is provided for reducing exfoliation relating to a pad such as a pad of a semiconductor. In one embodiment, a pad structure for reducing exfoliation includes an adhesion region on a first region. In another embodiment, a first inter-layer dielectric region relating to the first region is formed within an inter-layer region under the pad. In addition, a first inter-metal dielectric region relating to the first region is formed within an inter-metal region under the inter-layer region. In yet another embodiment, the first inter-metal region is formed under the first inter-layer region. Thus, at least the first inter-metal dielectric region includes a dielectric material and the first inter-layer dielectric region includes a dielectric material. Therefore, since a dielectric-dielectric interface can be formed between the first inter-metal dielectric region and the inter-layer dielectric region, exfoliation relating to the pad is reduced. |
