发明名称 PROCEDE DE FABRICATION DE PLOTS D'ASSEMBLAGE SUR UN SUPPORT POUR L'AUTO-ASSEMBLAGE D'UNE PUCE DE CIRCUIT INTEGRE SUR LE SUPPORT
摘要 <p>The invention concerns a method for producing at least one pad assembly (32, 50) on a support (19, 43) intended for the implementation of a method for self-assembling at least one element (10) on the support (19, 43), and a corresponding device. The production method comprises the following successive steps: (a) forming, on the support (19, 43), a layer (28, 48) of at least one fluorinated material around the location (30, 44) of the pad assembly (32, 50), the layer (28, 48) having a thickness greater than 10 nm; and (b) exposing the layer (28, 48) and the location (30, 44) to an ultraviolet treatment in the presence of ozone to form the pad assembly (32, 50) at said location (30, 44), a drop of liquid (16) having a static contact angle on the pad assembly (32, 50) less than or equal to 15°, the drop of liquid (16) having, after step (b), a static contact angle on the layer (28, 48) greater than or equal to 100°.</p>
申请公布号 FR2988517(B1) 申请公布日期 2014.04.11
申请号 FR20120052577 申请日期 2012.03.22
申请人 COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIESALTERNATIVES;STMICROELECTRONICS (CROLLES 2) SAS 发明人 DI CIOCCIO LEA;MERMOZ SEBASTIEN;SANCHEZ LOIC
分类号 H01L21/98 主分类号 H01L21/98
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