发明名称 HERMETICALLY SEALED ELECTRONIC DEVICE USING SOLDER BONDING
摘要 Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.
申请公布号 WO2012012745(A3) 申请公布日期 2014.03.20
申请号 WO2011US45050 申请日期 2011.07.22
申请人 FERRO CORPORATION;SRIDHARAN, SRINIVASAN;BLONSKI, ROBERT, P.;KHADILKAR, CHANDRASHEKHAR, S.;MALONEY, JOHN, J. 发明人 SRIDHARAN, SRINIVASAN;BLONSKI, ROBERT, P.;KHADILKAR, CHANDRASHEKHAR, S.;MALONEY, JOHN, J.
分类号 H05K5/06 主分类号 H05K5/06
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