HERMETICALLY SEALED ELECTRONIC DEVICE USING SOLDER BONDING
摘要
Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.
申请公布号
WO2012012745(A3)
申请公布日期
2014.03.20
申请号
WO2011US45050
申请日期
2011.07.22
申请人
FERRO CORPORATION;SRIDHARAN, SRINIVASAN;BLONSKI, ROBERT, P.;KHADILKAR, CHANDRASHEKHAR, S.;MALONEY, JOHN, J.
发明人
SRIDHARAN, SRINIVASAN;BLONSKI, ROBERT, P.;KHADILKAR, CHANDRASHEKHAR, S.;MALONEY, JOHN, J.