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发明名称
晶圆劈裂之前置检测方法
摘要
申请公布号
TWI429005
申请公布日期
2014.03.01
申请号
TW099145990
申请日期
2010.12.27
申请人
竑腾科技股份有限公司 高雄市楠梓加工出口区经六路61号
发明人
李明勋;张宏铭
分类号
H01L21/66;H01L21/304
主分类号
H01L21/66
代理机构
代理人
桂齐恒 台北市中山区长安东路2段112号9楼;林景郁 台北市中山区长安东路2段112号9楼
主权项
地址
高雄市楠梓加工出口区经六路61号
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