| 摘要 |
An image sensor module includes a rigid-flex board, an image sensor, a supporting plate, and a glue. The rigid-flex board defines a through hole, and includes a plurality of connecting pads adjacent to the through hole. The image sensor is positioned on one side of the rigid-flex board, and includes an image surface and a plurality of pins adjacent to the image surface. The image surface faces the through hole, and the pins are connected to the connecting pads. The supporting plate defines a receiving recess. The supporting plate is positioned on the side of the rigid-flex board. The image sensor is received in the receiving recess. The glue fills between the supporting plate and the rigid-flex board. |
