| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To form a finger wiring pattern 73a in a thick film (high in aspect ratio) and to prevent enlargement 3 or reduction 4 at the time of starting from generating on the main surface of a substrate 9, when the finger wiring pattern 73a crossing a buss wiring pattern 71a is formed on the main surface of the substrate 9. <P>SOLUTION: After paste is fed through a nozzle onto the buss wiring pattern 71a formed extending in a first direction on the main surface of the substrate, while the feed of the paste through the nozzle is continued, the substrate 9 is moved toward the nozzle along a second direction crossing the first direction, and the finger wiring pattern 73a is formed on the main surface of the substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
