发明名称 IMAGE SENSOR HAVING COMPRESSIVE LAYERS
摘要 An image sensor device including a semiconductor substrate that includes an array region and a black level correction region. The array region contains a plurality of radiation-sensitive pixels. The black level correction region contains one or more reference pixels. The substrate has a front side and a back side. The image sensor device includes a first compressively-stressed layer formed on the back side of the substrate. The first compressively-stressed layer contains silicon oxide, and is negatively charged. The second compressively-stressed layer contains silicon nitride, and is negatively charged. A metal shield is formed over at least a portion of the black level correction region. The image sensor device includes a third compressively-stressed layer formed on the metal shield and the second compressively-stressed layer. The third compressively-stressed layer contains silicon oxide. A sidewall of the metal shield is protected by the third compressively-stressed layer.
申请公布号 US2013329102(A1) 申请公布日期 2013.12.12
申请号 US201213492258 申请日期 2012.06.08
申请人 TSAO CHUN-HAN;LAI CHIH-YU;HUANG CHIH-HUI;WU CHENG-TA;TU YEUR-LUEN;WANG CHING-CHUN;TING SHYH-FANN;TSAI CHIA-SHIUNG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 TSAO CHUN-HAN;LAI CHIH-YU;HUANG CHIH-HUI;WU CHENG-TA;TU YEUR-LUEN;WANG CHING-CHUN;TING SHYH-FANN;TSAI CHIA-SHIUNG
分类号 H04N5/335 主分类号 H04N5/335
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