THERMOCONDUCTIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, THERMOCONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET-SHAPED MOLDING, PRODUCTION METHODS OF THEM, AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide a thermoconductive pressure-sensitive adhesive composition and a thermoconductive pressure-sensitive adhesive sheet-shaped molding, which are hardly torn even when being molded to be thin and include tackiness, and to provide production methods of the thermoconductive pressure-sensitive adhesive composition and the thermoconductive pressure-sensitive adhesive sheet-shaped molding, and also to provide electronic equipment including the thermoconductive pressure-sensitive adhesive composition or the thermoconductive pressure-sensitive adhesive sheet-shaped molding.SOLUTION: A thermoconductive pressure-sensitive adhesive composition is obtained by performing the polymerization reaction of a (meth)acrylic ester monomer (α1) and the cross-linking reaction of a (meth)acrylic ester polymer (A1) and/or a polymer having a (meth)acrylic ester monomer (α1)-derived structural unit, at the least, in a mixed composition containing the predetermined amount of: a (meth)acrylic resin composition (A) containing the (meth)acrylic ester polymer (A1) and the (meth)acrylic ester monomer (α1); a thermoconductive filler (B1) having ≤20 μm average particle size and <1.0 m/g BET specific surface area; a thermoconductive filler (B2) having ≤20 μm average particle size and ≥1.0 m/g BET specific surface area; a polyfunctional epoxy compound (C) having 2-10,000 functional groups; and a tackifier (D).