MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME

摘要

In this mounting structure, the periphery of a bonding material (106) is covered with a first reinforcing resin (107), said bonding material bonding a second electrode (104) of a circuit board (105) and a bump (103) of a semiconductor package (101) to each other. Furthermore, a gap between the circuit board (105), and the outer circumferential portion of the semiconductor package (101) is covered with a second reinforcing resin (108). The mounting structure has excellent drop resistance characteristics even if a soldering material having a melting point lower than the melting points of conventional bonding materials is used as the bonding material (106).