| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component having a semiconductor element mounted on a circuit board and a method of manufacturing the component which make it possible to effectively reduce a stress applied from the circuit board to the semiconductor element while maintaining a contact connection between the circuit board and the semiconductor element. <P>SOLUTION: The electronic component includes a substrate 30, and a substrate 10 formed on the substrate 30 and connected electrically to the substrate 30 by means of a protruding terminal. The protruding terminal includes a bundle 20 of linear structures of carbon element having a conductive film 22 on an end portion facing the substrate 30, and a bundle 34 of linear structures of carbon element having a conductive film on an end portion facing the substrate 10. <P>COPYRIGHT: (C)2010,JPO&INPIT |
