| 摘要 |
<p>The invention relates to a method for producing a hybridized device, which consists of producing a first microelectronic component (10) provided with metal beads (16) on a surface (14) thereof, and a second microelectronic component (12) provided, on a surface (22) thereof, with connection elements (26) that correspond to said metal beads (16), and hybridizing the first and second components (10, 12) so as to attach the metal beads (16) of the first component (10) to the connection elements (26) of the second component (12). The manufacture of the second microelectronic component (12) consists of producing a substrate (20) provided with cavities (24) at the locations provided for the connection elements (26), and producing resistive elements which are made of a fusible metal (26) and which are suspended above the cavities (24), respectively. The hybridization of the first and second components (10, 12) consists of transferring the first component (10) onto the second component (12) so as to cause the metal beads (16) to engage with the suspended resistive elements (26), and cause an electrical current to flow through the resistive elements (26) so as to melt the latter.</p> |
