发明名称 MATERIAL DEPOSITION SYSTEM AND METHOD FOR DEPOSITING MATERIALS ON A SUBSTRATE
摘要 A material deposition system for depositing material on an electronic substrate includes a frame, a support coupled to the frame and configured to support an electronic substrate during a deposit operation, a gantry coupled to the frame, and a deposition head coupled to the gantry. The deposition head is movable over the support by movement of the gantry. The deposition head includes a chamber configured to hold material, an actuator configured to push a volume of material out of the chamber, a needle extending from the chamber and terminating in a needle orifice, and at least two air jets located on opposite sides of the needle orifice. A desired volume of material is formed at the needle orifice in response to the actuator, and each of the at least two air jets produce a timed pulse of air to create a micro-droplet from the desired volume and to accelerate the micro-droplet to high velocity. Other embodiments of the material deposition system and method of dispensing are further disclosed.
申请公布号 WO2013158588(A2) 申请公布日期 2013.10.24
申请号 WO2013US36695 申请日期 2013.04.16
申请人 ILLINOIS TOOL WORKS INC. 发明人 CROUCH, KENNETH C.;TRACY, ROBERT W.;KARLINSKI, THOMAS J.;REID, SCOTT A.
分类号 B08B9/032 主分类号 B08B9/032
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