发明名称 |
Multichip Power Semiconductor Device |
摘要 |
An electronic device includes a first chip carrier and a second chip carrier isolated from the first chip carrier. A first power semiconductor chip is mounted on and electrically connected to the first chip carrier. A second power semiconductor chip is mounted on and electrically connected to the second chip carrier. An electrically insulating material is configured to at least partially surround the first power semiconductor chip and the second power semiconductor chip. An electrical interconnect is configured to electrically connect the first power semiconductor chip to the second power semiconductor chip, wherein the electrical interconnect has at least one of a contact clip and a galvanically deposited conductor.
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申请公布号 |
US2013256856(A1) |
申请公布日期 |
2013.10.03 |
申请号 |
US201213431125 |
申请日期 |
2012.03.27 |
申请人 |
MAHLER JOACHIM;BEMMERL THOMAS;PRUECKL ANTON;INFINEON TECHNOLOGIES AG |
发明人 |
MAHLER JOACHIM;BEMMERL THOMAS;PRUECKL ANTON |
分类号 |
H01L23/495;H01L21/50;H01L23/48 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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