| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus capable of restraining vaporized debris in particular, which is produced during laser beam machining, from adhering to a condenser and the like, without conducting frequent maintenances.SOLUTION: A laser beam machining apparatus includes: a chuck table which holds a wafer W; a laser beam irradiation means for applying a laser beam L to a surface WS of the wafer W; a protection means 30; and a debris discharge means 40. The protection means 30 comprises a lower opening 32b through which the laser beam L passes. The debris discharge means 41 comprises a bulkhead 41 which surrounds the periphery of a debris scattering range, an air curtain blowout mechanism 42, and a suction mechanism 43. The air curtain blowout mechanism 42 has an exhaust nozzle 44 near the lower opening 32b, and covers the lower opening 32b with gas blown out from the exhaust nozzle 44. The suction mechanism 43 also sucks in debris while sucking in the gas on the downstream side of the gas blown out by the air curtain blowout mechanism 42. |
