发明名称 MODULE ON BOARD FORM FACTOR FOR EXPANSION BOARDS
摘要 <p>A new form factor for circuit boards can be employed for directly connecting an expansion board to a motherboard without the need for PCIe hardware such as sockets, retainers, screw and nut assemblies, and connectors. The module on board form factor for an expansion board comprises a first side of the expansion board and a second side of the expansion board located physically opposite to the first side of the expansion board. The first side of the expansion board comprises one or more components configured to provide functionality associated with the expansion board. The second side of the expansion board comprises a plurality of connection leads, such as solder connections, that directly couple the expansion board to the motherboard.</p>
申请公布号 WO2013126573(A1) 申请公布日期 2013.08.29
申请号 WO2013US27140 申请日期 2013.02.21
申请人 QUALCOMM INCORPORATED 发明人 WANG, CHUN-TAI
分类号 G06F1/18;H01R12/71;H05K1/14 主分类号 G06F1/18
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