发明名称 METHOD FOR MANUFACTURING PHOSPHOR FILM AND METHOD FOR MAKING LED PACKAGE HAVING THE PHOSPHOR FILM
摘要 A method for manufacturing a phosphor film for use in the an LED package, includes following steps: providing a mold comprising a first and a second molding part, the first molding part and the second molding part cooperatively forming a molding chamber, the first molding part defining an opening communicating with the molding chamber; filling a mixture of phosphor particles and a transparent glue into the first opening; moving a piston in the first opening along a direction from the first molding part to the second molding part, thereby pressing the mixture into the molding chamber; solidifying the mixture to form a phosphor film; and removing the phosphor film from the mold. The phosphor film is used to be attached to a top face of an LED chip opposite a substrate on which the LED chip is mounted.
申请公布号 US2013217160(A1) 申请公布日期 2013.08.22
申请号 US201213600128 申请日期 2012.08.30
申请人 CHEN LUNG-HSIN;TSENG WEN-LIANG;CHEN PIN-CHUAN;ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. 发明人 CHEN LUNG-HSIN;TSENG WEN-LIANG;CHEN PIN-CHUAN
分类号 H01L33/50;B29C45/02;B44C1/22 主分类号 H01L33/50
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