| 摘要 |
PROBLEM TO BE SOLVED: To apply electroless nickel or nickel alloy plating to a nonconductive substrate by providing metallic nickel as a catalyst by simple and convenient treatment.SOLUTION: In an electroless plating method for applying electroless nickel or nickel alloy plating to the substrate, nickel nanoparticles with an average particle size of 1-200 nm are distributed in a solvent by using a dispersant or not using it, and a nonconductive substrate is immersed in a pretreatment liquid wherein the content of nickel nanoparticles is optimized within a predetermined range, and metallic nickel is given as a catalyst, thereby applying electroless nickel or nickel alloy plating to the nonconductive substrate. Since the refined nickel nanoparticles with a particle size of 200 nm or less are used to prepare the pretreatment liquid, after the nonconductive substrate is immersed in the pretreatment liquid, a homogeneous plating film can be formed on the entire surface of the substrate. |
