| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin sealed semiconductor apparatus controlling dispersion of solder and adhesion of solder to a bonding pad when mounting an electronic component and to provide a method of manufacturing the apparatus. <P>SOLUTION: A rectangular circuit board 12 in a planar view is arranged to be larger than a supporting part 14 of a lead frame 16 in a longitudinal direction. An exposure part 32 protruded from the supporting part 14 is arranged in a position confronted with lead terminals 22 on the other face 12B on which the electronic component 18 is not mounted. The bonding pads 36 connecting bonding wires 34 extended from the lead terminals 22 with the electronic component 18 are disposed in the exposure part 32. The bonding pads 36 are installed on the other face 12B opposite to one face 12A of the circuit board 12 on which the electronic component 18 is mounted. Thus, dispersion of solder and adhesion of solder to the bonding pads 36 are controlled when mounting the electronic component 18 by reflow-soldering. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT</p> |
