发明名称 |
Semiconductor device package assembly and method of manufacturing a semiconductor device |
摘要 |
A semiconductor device package assembly increased in production efficiency of semiconductor devices by enabling the number of semiconductor device packages held by a carrier to be increased. A predetermined area of a first housing (20) molded of white-colored resin, which holds a plurality of bent contact (10), is covered by a second housing (30) molded of black-colored resin, and a plurality of second housings (30) are supported by a secondary molding carrier (60) in high density. A linking portion of each contact (10) and one or both of the first and second housings (20), (30) are integrated by insert molding. |
申请公布号 |
EP2587558(A2) |
申请公布日期 |
2013.05.01 |
申请号 |
EP20120186099 |
申请日期 |
2012.09.26 |
申请人 |
JAPAN AVIATION ELECTRONICS INDUSTRY LIMITED |
发明人 |
KUDO, TAKAAKI;IKENAGA, NAOFUMI;URANO, TETSU |
分类号 |
H01L33/48;H01L33/62 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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