首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
UN NUEVO SISTEMA DE FORJADO DE PISOS
摘要
申请公布号
ES190878(A1)
申请公布日期
1950.09.01
申请号
ES19780001908
申请日期
1949.12.19
申请人
GARCIA NAVARRO, RAMON
发明人
分类号
(IPC1-7):E04
主分类号
(IPC1-7):E04
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Methods for Forming Semiconductor Device Structures
METHOD TO FORM STRAINED CHANNEL IN THIN BOX SOI STRUCTURES BY ELASTIC STRAIN RELAXATION OF THE SUBSTRATE
III-V SEMICONDUCTOR DEVICE HAVING SELF-ALIGNED CONTACTS
METHOD AND APPARATUS FOR POWER DEVICE WITH MULTIPLE DOPED REGIONS
DIELECTRIC ISOLATED FIN WITH IMPROVED FIN PROFILE
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME
SEMICONDUCTOR DEVICE
Organic Optoelectronic Component and Method for Operating the Organic Optoelectronic Component
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SAME, AND METHOD OF CONTROLLING SEMICONDUCTOR DEVICE
THIN FILM TRANSISTOR SUBSTRATE AND DISPLAY USING THE SAME
THIN FILM TRANSISTOR AND THIN FILM TRANSISTOR ARRAY
Semiconductor Device and Electronic Device
NONVOLATILE SEMICONDUCTOR MEMORY DEVICE HAVING ELEMENT ISOLATING REGION OF TRENCH TYPE
NON-VOLATILE MEMORY DEVICE
Low Threshold Voltage and Inversion Oxide Thickness Scaling for a High-K Metal Gate P-Type MOSFET
Semiconductor Devices and Methods of Manufacture Thereof
Semiconductor Device Arrangement with a First Semiconductor Device and with a Plurality of Second Semiconductor Devices
Packaged Semiconductor Devices and Packaging Methods
WIRE-BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Semiconductor Device and Method of Forming Encapsulated Wafer Level Chip Scale Package (EWLCSP)