发明名称 |
Tuning the efficiency in the transmission of radio-frequency signals using micro-bumps |
摘要 |
A device includes a die including a main circuit and a first pad coupled to the main circuit. A work piece including a second pad is bonded to the die. A first plurality of micro-bumps is electrically coupled in series between the first and the second pads. Each of the plurality of micro-bumps includes a first end joining the die and a second end joining the work piece. A micro-bump is bonded to the die and the work piece. The second pad is electrically coupled to the micro-bump.
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申请公布号 |
US8399961(B2) |
申请公布日期 |
2013.03.19 |
申请号 |
US20100974896 |
申请日期 |
2010.12.21 |
申请人 |
YEN HSIAO-TSUNG;LIN YU-LING;LEE CHENG HUNG;KUO CHIN-WEI;CHEN HO-HSIANG;JENG MIN-CHIE;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
YEN HSIAO-TSUNG;LIN YU-LING;LEE CHENG HUNG;KUO CHIN-WEI;CHEN HO-HSIANG;JENG MIN-CHIE |
分类号 |
H01L27/08 |
主分类号 |
H01L27/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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