| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress occurrence of cracks of a package resin after dicing separation. <P>SOLUTION: In a light emitting device 1, a light emitting element 2 emitting light is mounted on a lead frame 3, and lead frames 3, 4 constituting electrodes of the light emitting element 2 and a resin cavity molding package 5 integrally molded by a resin are used. In the light emitting device 1, a part or whole of cross-section corner portions of holding parts (hanger leads 3a, 4a) of the lead frames 3, 4 are rounded, the holding parts (hanger leads 3a, 4a) applying concentrated stress on the resin to cause occurrence of cracks during cutting by a blade 7. <P>COPYRIGHT: (C)2013,JPO&INPIT |
