| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive damping board that further improves damping performance. <P>SOLUTION: The adhesive damping board 1 includes: a restriction layer 2; a damping layer 3 composed of a thermoplastic resin composite including a thermoplastic resin laminated on the restriction layer 2 and having a melting point of a temperature of 23°C higher, a polymer having a glass transition point that is not higher than the melting point of the thermoplastic resin, and a tackifier and a filler; and a pressure-sensitive adhesive layer 4 laminated on the damping layer 3, wherein a loss coefficient in a thickness of 1.8 mm and a frequency of 500 Hz measured by a central excitation method is not lower than 0.1 in the entire temperature of 20-60°C, and adhesion by 90 degree peeling test on a stainless board measured at a temperature of 23°C in a peel rate 300 mm per minute on the basis of JIS Z0237 is not lower than 0.1N/25 mm. Accordingly, the adhesive damping board 1 can adhere at a normal temperature via the pressure-sensitive adhesive layer 4 and provide excellent damping performance with respect to vibrations in a wide frequency region including high frequency under a high temperature. <P>COPYRIGHT: (C)2013,JPO&INPIT |
