发明名称 |
POWER CONVERSION APPARATUS |
摘要 |
<P>PROBLEM TO BE SOLVED: To suppress heating of a heating semiconductor element and to realize an optimum cooling structure of a module case by detecting a time rate of change of a temperature detection element in a power conversion apparatus to predict rising of temperature in advance for applying failsafe. <P>SOLUTION: To solve the above described issue, the power conversion apparatus includes detection means for detecting a time rate of change of the temperature of a module case of the semiconductor element or the element itself, and a resistance variable circuit for making a gate resistance value of the element variable. When it is determined that the time rate of change of the detection temperature has come to a predetermined set value or larger, the gate resistance value is reduced by the resistance variable circuit. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013005067(A) |
申请公布日期 |
2013.01.07 |
申请号 |
JP20110131788 |
申请日期 |
2011.06.14 |
申请人 |
HITACHI AUTOMOTIVE SYSTEMS LTD |
发明人 |
HAKUGASHIRA TAKUMA;SATO TOSHIYA;NANBA AKIHIRO;MIMA AKIRA |
分类号 |
H03K17/14;H02M1/08;H02M7/48;H03K17/00;H03K17/08 |
主分类号 |
H03K17/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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