| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, in which an adhesive strength between a semiconductor chip and a die bond material on a mounting substrate is increased to a higher degree. <P>SOLUTION: A semiconductor device 10 comprises a semiconductor chip 1 and a mounting substrate 2 to which the semiconductor chip 1 is fixed by a die bond material 3. The semiconductor chip 1 includes a catch part 1a on lateral faces 1c of the semiconductor chip 1, which is buried in the die bond material 3 to catch the die bond material 3. <P>COPYRIGHT: (C)2013,JPO&INPIT |
