INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF

摘要

PURPOSE: An integrated circuit packaging system with vertical interconnections and a manufacturing method for same are provided to mount a second substrate on a non-active layer of an integrated circuit, thereby reducing the size of a package. CONSTITUTION: Vertical interconnections(110) are adhered along the peripheral part of a first substrate(104). An integrated circuit(114) is mounted on the first substrate. The vertical interconnections surround the integrated circuit. A second substrate(124) is mounted on the vertical interconnections and the integrated circuit.