发明名称 |
SECONDARY DEVICE INTEGRATION INTO CORELESS MICROELECTRONIC DEVICE PACKAGES |
摘要 |
The present disclosure relates to the field of fabricating microelectronic device packages and, more particularly, to microelectronic device packages having bumpless build-up layer (BBUL) designs, wherein at least one secondary device is disposed within the thickness (i.e. the z-direction or z-height) of the microelectronic device of the microelectronic device package.
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申请公布号 |
US2012326271(A1) |
申请公布日期 |
2012.12.27 |
申请号 |
US201113169162 |
申请日期 |
2011.06.27 |
申请人 |
TEH WENG HONG;GUZEK JOHN S. |
发明人 |
TEH WENG HONG;GUZEK JOHN S. |
分类号 |
H01L29/66;H01L21/283;H01L21/56;H01R43/00 |
主分类号 |
H01L29/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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